The Industrial Network & PLC define how IO is structured on today's Packaging Machines. Is there an enabling technology where a designer can structure their IO independent of the PLC and Industrial Network? Do you need to reduce costs while increasing productivity? Are you looking for new technical solutions that are simpler to implement and which help reduce downtime? IO-Link is the technology that enables network independence. Through IO-Link, customers have found cost savings of 30% or greater encompassing component costs and costs associated with integration and design time.

We will discuss:

• Today's common Networking Architecture
• Emerging Modular IO Solution
• IO-Link enabling technology
• The endless possibilities of the IO-Link Port
• Cost saving advantages of IO-Link
• Innovative solutions through IO-Link
• Diagnostic capabilities of IO-Link
• Reducing downtown and increasing Uptime
• Field Application Examples
• Products Available Today

Intended audience: Anyone looking to save time and money on design and integration of packaging machines. The presentation will also be beneficial to end users that are looking for innovative solutions to enhance existing machine capabilities. This would include controls engineers, design engineers, and engineering managers.

About the Speaker:
Jason A. Dias, Quality & Engineering Services Coordinator, Balluff Canada Inc.
Jason Dias is responsible for engineering support of Balluff's higher end products including Industrial Networking, RFID, and Vision. He comes with many years of experience in the Automation Industry and holds a Bachelor of Technology in Manufacturing Engineering and an Advanced Diploma in Automation and Robotics.