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Eric Bromley, Kyzen
ABSTRACT
Manufacturers of printed circuit assemblers are challenged with a continuous stream of technology advances to improve performance, increase through put, and efficiency. Electronics innovations are enabled by miniaturization of components and devices. In the age of no-clean and lead-free soldering, assemblers need manufacturing flexibilities to clean stencils, populated surface mount, through-hole assemblies, and re-work boards. Engineering Cleaning Fluids are typically designed for specific equipment and applications. This paper introduces an innovative aqueous cleaning fluid designed for use in batch and continuous inline equipment that works for cleaning stencils, populated surface mount and through-hole assemblies, and re-work boards.
ABOUT THE SPEAKER
Information to come.
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